Midea's Full-Stack Data Centre Solution Makes Global Debut

Midea's Full-Stack Data Centre Solution Makes Global Debut
2026/05/26

The "Feel the Future" launch event, Kuala Lumpur, Malaysia — May 21

On May 21, Midea Building Technologies held a "Feel the Future" launch event in Kuala Lumpur, Malaysia, officially unveiling its data centre thermal management solution for AIDC infrastructure in global markets — including Australia, where demand for AI-ready data centre capacity is outpacing supply for the first time on record.*

With billions of dollars committed to new hyperscale facilities across Sydney and Melbourne*, and the federal government's National AI Plan setting clear expectations around energy efficiency and water use, the timing of Midea's global launch is directly relevant to the Australian market. The solution targets three core industry pain points: slow delivery, energy efficiency anxiety, and high total cost — aimed at ensuring fast, reliable, and sustainable computing output for customers.

Full-Chain Product Matrix: Defining a New Paradigm for AI Infrastructure

As computing density continues to rise, data centres face simultaneous pressure from high costs and high energy consumption. Customer needs have moved beyond single devices toward full-stack capability covering consulting, design, delivery, and operations.

Drawing on long-term expertise in HVAC technology, intelligent manufacturing, and engineering delivery, Midea Building Technologies is building a full lifecycle data centre thermal management solution for high-density computing — covering solution consulting, planning and design, equipment selection, product delivery, and ongoing operations. This creates a closed-loop service capability spanning from cold source to endpoint, from equipment to system, and from construction to operation.

In terms of technical architecture, Midea Building Technologies has developed a full-stack liquid cooling matrix covering cold sources, CDUs, liquid cooling endpoints, and digital operations. It also introduces an "air-liquid co-source" integrated architecture enabling flexible coordination between room-level air cooling and server-level liquid cooling — a particularly relevant capability for Australian operators managing high summer temperatures and water efficiency requirements. Backed by a global manufacturing network, prefabricated delivery capability, scalable intelligent manufacturing, and a digital full-lifecycle service platform based on iBUILDING, the company delivers more efficient, reliable, and sustainable data centre thermal solutions.

All-Scenario Data Centre Thermal Management Solution display

Core products include a multi-tier matrix:

1. Maglev Active CDU

This product uses an integrated innovative architecture that combines the maglev cold source and distribution unit into one, reducing footprint by over 50%. It can help achieve a system-level PUE of less than 1.2, while effectively reducing delivery time and operating costs. 

Air-Cooled Magnetic Centrifugal Chiller — The Ultimate High Efficiency Cooling Source

2. Next-generation air-cooled maglev centrifugal chiller

Designed for high-temperature and water-scarce environments, this chiller maintains high energy efficiency under demanding operating conditions — well suited to the Australian climate — with advantages including stability, reliability, and low performance degradation.

3. Industrial-grade CDU

With a heat exchange capacity of up to 2,600 kW, it supports high-availability architecture design and meets the elevated requirements for safety, stability, and continuous operation in high-density computing scenarios.

Coolant Distribution Unit — Designed for Uptime.

Through its system-level product matrix and full lifecycle service capability, Midea Building Technologies is providing more predictable thermal management solutions for high-density data centres, helping customers achieve a better balance between computing growth, energy efficiency optimisation, and green low-carbon goals.

Building a Liquid Cooling Smart Manufacturing Base

To achieve self-controlled core processes and improve large-scale delivery capability, construction formally began in March this year on the Shunde Liquid Cooling Smart Manufacturing Base, with a total investment of over 1 billion RMB. The base will drive large-scale production of natural cooling maglev chillers, CDUs, and other core products, building a full-chain liquid cooling capability from R&D and manufacturing to delivery.

Midea Building Tech. AIDC-Hub Global Announcement Ceremony

At this event, the smart manufacturing base was unveiled to global customers for the first time. The base is expected to be completed and operational by August 2027, and upon completion will continue to support the green, efficient, and sustainable development of AI data centres worldwide.

Ecosystem Collaboration: Industry-Academia-Research Advancing the Technology Frontier

The event also featured two expert presentations from the National University of Singapore, whose research into high-density data centre cooling is directly applicable to the challenges facing operators across the Asia-Pacific region, including Australia.

Dr. Md Raisul Islam introduced the Sustainable Tropical Data Centre Testbed (STDCT) — a 0.5MW open real-world laboratory focused on addressing energy efficiency, water consumption, and carbon emission challenges in data centre design. The testbed aims to validate next-generation technologies including enhanced indirect evaporative cooling and direct chip hybrid cooling. Midea Building Technologies is actively exploring collaboration with NUS on the next-generation testbed to jointly address more advanced technical challenges.

Dr. Md Raisul Islam presenting at the Feel the Future 2026 Data Centre Solution Conference

Dr. Guo Shuai noted in his presentation that for high-density cabinets exceeding 20kW, AM integrated cold plates are the key to breaking through thermal management bottlenecks. His team's topology-optimised fins and leak-free design significantly improve thermal performance while substantially reducing pump power, delivering an efficient and reliable chip-level thermal solution for AI chips.

Dr. Guo Shuai presenting at the Feel the Future conference

In the roundtable discussion, experts noted that thermal design is shifting from a support service to an architectural core. Going forward, the industry needs to look beyond a single PUE metric and focus on computing energy efficiency and total cost of ownership. Integrated real-world testing and system-level engineering are key to reducing risk and accelerating deployment.

From full-stack system capability to a complete product portfolio, from core manufacturing positioning to ecosystem collaborative innovation, Midea Building Technologies is responding to the full scope of AI-era data centre cooling challenges with systematic capability — committed to becoming a key builder of global AI computing infrastructure.Roundtable panel: "AI, Energy, and Data Centres — The Physical Reality"

 

 

 

* Source: M3 Property / Data Center Dynamics — Australia Data Center Market Expands Forty-Fold (datacenterdynamics.com)

* Source: CBRE Asia Pacific Data Centre Report, February 2026; Data Center Dynamics / M3 Property, November 2025.